Yousra Ghazaoui, Mohammed EL Ghzaoui, Sudipta Das, BTP Madhav, Ali el Alami
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The methodology used in this work is to design a high gain array antenna and to identify the best possible power divider to deliver the power in an optimized way. The design methodology adopts several steps like the selection of proper substrate material as per the design specification, size of the antenna as per the frequency of operation and application-specific environment condition. The simulation has been performed on the designed antenna in the electromagnetic simulation tool (high-frequency structure simulator [HFSS]), and optimization has been done with parametric analysis, and then the final array antenna model is proposed. The proposed array contains 2-patch elements excited by one port adapted to 50 Ω through a T-junction power divider. The 1 × 2 array configuration with the suggested geometry helps to improve the overall gain of the antenna, and the implementation of the T-junction power divider provides enhanced bandwidth. The proposed array designed using a 1.6 mm thick flame retardant substrate occupies a compact area of 14 × 12.14 mm<sup>2</sup>.</p><!--/ Abstract__block -->\n<h3>Findings</h3>\n<p>The prototype of the array antenna is fabricated and measured to validate the design concept. A good agreement has been reached between the measured and simulated antenna parameters. The measured results confirm its wideband and high gain characteristics, covering 24.77–28.80 GHz for <em>S</em><sub>11</sub>= –10 dB with a peak gain of about 15.16 dB at 27.65 GHz.</p><!--/ Abstract__block -->\n<h3>Originality/value</h3>\n<p>The proposed antenna covers the bandwidth requirements of the 26 GHz n258 band (24.25–27.50 GHz) to be deployed in the UK and Europe. The suggested antenna structure also covers the federal communications commission (FCC)-regulated 28 GHz n261 band (27.5–28.35 GHz) to be deployed in America and Canada. 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The proposed array contains 2-patch elements excited by one port adapted to 50 Ω through a T-junction power divider. The 1 × 2 array configuration with the suggested geometry helps to improve the overall gain of the antenna, and the implementation of the T-junction power divider provides enhanced bandwidth. The proposed array designed using a 1.6 mm thick flame retardant substrate occupies a compact area of 14 × 12.14 mm<sup>2</sup>.</p><!--/ Abstract__block -->\\n<h3>Findings</h3>\\n<p>The prototype of the array antenna is fabricated and measured to validate the design concept. A good agreement has been reached between the measured and simulated antenna parameters. 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A compact high gain wideband millimeter wave 1 × 2 array antenna for 26/28 GHz 5G applications
Purpose
This paper aims to present the design, fabrication and analysis of a wideband, enhanced gain 1 × 2 patch antenna array with a simple profile structure to meet the desired antenna traits, such as wide bandwidth, high gain and directional patterns expected for the upcoming fifth-generation (5G) wireless applications in the millimeter wave band. To enhance these parameters (bandwidth and gain), a new antenna geometry by using a T-junction power divider is presented.
Design/methodology/approach
The theory behind this paper is connected with advancements in the 5G communications related to antennas. The methodology used in this work is to design a high gain array antenna and to identify the best possible power divider to deliver the power in an optimized way. The design methodology adopts several steps like the selection of proper substrate material as per the design specification, size of the antenna as per the frequency of operation and application-specific environment condition. The simulation has been performed on the designed antenna in the electromagnetic simulation tool (high-frequency structure simulator [HFSS]), and optimization has been done with parametric analysis, and then the final array antenna model is proposed. The proposed array contains 2-patch elements excited by one port adapted to 50 Ω through a T-junction power divider. The 1 × 2 array configuration with the suggested geometry helps to improve the overall gain of the antenna, and the implementation of the T-junction power divider provides enhanced bandwidth. The proposed array designed using a 1.6 mm thick flame retardant substrate occupies a compact area of 14 × 12.14 mm2.
Findings
The prototype of the array antenna is fabricated and measured to validate the design concept. A good agreement has been reached between the measured and simulated antenna parameters. The measured results confirm its wideband and high gain characteristics, covering 24.77–28.80 GHz for S11= –10 dB with a peak gain of about 15.16 dB at 27.65 GHz.
Originality/value
The proposed antenna covers the bandwidth requirements of the 26 GHz n258 band (24.25–27.50 GHz) to be deployed in the UK and Europe. The suggested antenna structure also covers the federal communications commission (FCC)-regulated 28 GHz n261 band (27.5–28.35 GHz) to be deployed in America and Canada. The low profile, compact size, simple structure, wide bandwidth, high gain and desired directional radiation patterns confirm the applicability of the suggested array antenna for the upcoming 5 G wireless systems.
期刊介绍：
Circuit World is a platform for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes.
Circuit World covers a broad range of topics, including:
• Circuit theory, design methodology, analysis and simulation
• Digital, analog, microwave and optoelectronic integrated circuits
• Semiconductors, passives, connectors and sensors
• Electronic packaging of components, assemblies and products
• PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes)
• Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal)
• Internet of Things (IoT).
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