通过分层序列/集合模型学习切割,实现高效混合整数编程。

Jie Wang, Zhihai Wang, Xijun Li, Yufei Kuang, Zhihao Shi, Fangzhou Zhu, Mingxuan Yuan, Jia Zeng, Yongdong Zhang, Feng Wu
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引用次数: 0

摘要

切平面(切口)在求解混合整数线性方程组(MILPs)中发挥着重要作用,MILPs 在现实世界中有着许多重要的应用。切面选择在很大程度上取决于 (P1) 选择哪些切面和 (P2) 选择多少切面。虽然现代 MILP 求解器通过人类设计的启发式方法来解决 (P1)-(P2) 问题,但机器学习有可能学习到更有效的启发式方法。然而,现有的许多基于学习的方法都是学习选择哪些切点,而忽略了学习选择多少切点的重要性。此外,我们还观察到,(P3)选择哪种切分顺序对 MILP 求解器的效率也有很大影响。为了应对这些挑战,我们提出了一种新颖的分层序列/集合模型(HEM)来学习切分选择策略。具体来说,HEM 是一个双层模型:(1) 高层模块用于学习选择多少个切口;(2) 低层模块将切口选择表述为序列/集合到序列学习问题,用于学习选择有序子集的策略,该子集的有序性由高层模块决定。据我们所知,HEM 是第一种数据驱动的方法,能同时很好地解决(P1)-(P3)问题。实验证明,在 11 个具有挑战性的 MILP 基准(包括两个华为的实际问题)上,HEM 显著提高了 MILP 的求解效率。
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Learning to Cut via Hierarchical Sequence/Set Model for Efficient Mixed-Integer Programming.

Cutting planes (cuts) play an important role in solving mixed-integer linear programs (MILPs), which formulate many important real-world applications. Cut selection heavily depends on (P1) which cuts to prefer and (P2) how many cuts to select. Although modern MILP solvers tackle (P1)-(P2) by human-designed heuristics, machine learning carries the potential to learn more effective heuristics. However, many existing learning-based methods learn which cuts to prefer, neglecting the importance of learning how many cuts to select. Moreover, we observe that (P3) what order of selected cuts to prefer significantly impacts the efficiency of MILP solvers as well. To address these challenges, we propose a novel hierarchical sequence/set model (HEM) to learn cut selection policies. Specifically, HEM is a bi-level model: (1) a higher-level module that learns how many cuts to select, (2) and a lower-level module-that formulates the cut selection as a sequence/set to sequence learning problem-to learn policies selecting an ordered subset with the cardinality determined by the higher-level module. To the best of our knowledge, HEM is the first data-driven methodology that well tackles (P1)-(P3) simultaneously. Experiments demonstrate that HEM significantly improves the efficiency of solving MILPs on eleven challenging MILP benchmarks, including two Huawei's real problems.

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