{"title":"高导体损耗线路 2x-thru 解嵌中的参考阻抗估算","authors":"Chiu-Chih Chou","doi":"10.1109/TEMC.2024.3445346","DOIUrl":null,"url":null,"abstract":"The 2x-thru de-embedding has emerged as an attractive alternative to the classical TRL for \n<italic>S</i>\n parameter measurement of printed circuit board and packaging devices, mainly due to its simplicity that only one THRU standard suffices to fully characterize the test fixtures over broad bandwidth. The \n<italic>S</i>\n parameters after 2x-thru de-embedding are referenced to the characteristic impedance of the transmission line in THRU, and accurate estimation of this reference impedance (Zref) is important for subsequent renormalization and time-domain simulation. In 2x-thru literature, only constant estimate of Zref, mostly based on the time-domain reflectometry (TDR), has been reported. However, the characteristic impedance of a transmission line is frequency dependent, and the TDR may not be flat for high conductor-loss lines. In this article, we analytically show that the TDR is an increasing function in time, and propose an innovative method to estimate Zref by fitting the TDR with a causal impedance model. Simulation and measurement examples are provided to validate the proposed theory and technique, and to show the importance of using accurate Zref for renormalization in 2x-thru de-embedding.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 5","pages":"1315-1328"},"PeriodicalIF":2.0000,"publicationDate":"2024-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Estimation of Reference Impedance in 2x-thru De-embedding With High Conductor-Loss Lines\",\"authors\":\"Chiu-Chih Chou\",\"doi\":\"10.1109/TEMC.2024.3445346\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The 2x-thru de-embedding has emerged as an attractive alternative to the classical TRL for \\n<italic>S</i>\\n parameter measurement of printed circuit board and packaging devices, mainly due to its simplicity that only one THRU standard suffices to fully characterize the test fixtures over broad bandwidth. The \\n<italic>S</i>\\n parameters after 2x-thru de-embedding are referenced to the characteristic impedance of the transmission line in THRU, and accurate estimation of this reference impedance (Zref) is important for subsequent renormalization and time-domain simulation. In 2x-thru literature, only constant estimate of Zref, mostly based on the time-domain reflectometry (TDR), has been reported. However, the characteristic impedance of a transmission line is frequency dependent, and the TDR may not be flat for high conductor-loss lines. In this article, we analytically show that the TDR is an increasing function in time, and propose an innovative method to estimate Zref by fitting the TDR with a causal impedance model. Simulation and measurement examples are provided to validate the proposed theory and technique, and to show the importance of using accurate Zref for renormalization in 2x-thru de-embedding.\",\"PeriodicalId\":55012,\"journal\":{\"name\":\"IEEE Transactions on Electromagnetic Compatibility\",\"volume\":\"66 5\",\"pages\":\"1315-1328\"},\"PeriodicalIF\":2.0000,\"publicationDate\":\"2024-09-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electromagnetic Compatibility\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10676314/\",\"RegionNum\":3,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electromagnetic Compatibility","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10676314/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Estimation of Reference Impedance in 2x-thru De-embedding With High Conductor-Loss Lines
The 2x-thru de-embedding has emerged as an attractive alternative to the classical TRL for
S
parameter measurement of printed circuit board and packaging devices, mainly due to its simplicity that only one THRU standard suffices to fully characterize the test fixtures over broad bandwidth. The
S
parameters after 2x-thru de-embedding are referenced to the characteristic impedance of the transmission line in THRU, and accurate estimation of this reference impedance (Zref) is important for subsequent renormalization and time-domain simulation. In 2x-thru literature, only constant estimate of Zref, mostly based on the time-domain reflectometry (TDR), has been reported. However, the characteristic impedance of a transmission line is frequency dependent, and the TDR may not be flat for high conductor-loss lines. In this article, we analytically show that the TDR is an increasing function in time, and propose an innovative method to estimate Zref by fitting the TDR with a causal impedance model. Simulation and measurement examples are provided to validate the proposed theory and technique, and to show the importance of using accurate Zref for renormalization in 2x-thru de-embedding.
期刊介绍:
IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.