第 3 章材料和电子元件的可焊性

V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov
{"title":"第 3 章材料和电子元件的可焊性","authors":"V. L. Lanin,&nbsp;V. A. Emel’yanov,&nbsp;I. B. Petuhov","doi":"10.3103/S1068375524700030","DOIUrl":null,"url":null,"abstract":"<p>The concept of solderability is rigorously defined, accompanied by the proposal of quantitative criteria for its assessment. A comprehensive categorization of solderable materials into three distinct groups—namely, easily solderable, moderately solderable, and unsolderable—is proposed based on solderability parameters. Practical recommendations are given for the effective deployment of solderability testing methodologies across a spectrum of materials and electronic components. Detailed expositions are offered on the methods employed in the evaluation of solderability, encompassing solder immersion, measurement of solder spreading area, and assessment of capillary penetration into gaps. Schematic representations of these evaluation techniques, alongside descriptions of the requisite apparatus for their implementation, are presented. Furthermore, tabulated data on the solder spreading factors for diverse categories of chemical and electroplated coatings, including hot tinning, are given. Prolonged storage may lead to the formation of oxide films on the surface of coatings, thereby deteriorating solderability. To enhance the quality of electroplated coatings, it is recommended to employ periodic currents in nonstationary electrolysis modes during the deposition of electroplated coatings.</p>","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":"60 3","pages":"317 - 331"},"PeriodicalIF":0.9000,"publicationDate":"2024-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Chapter 3. Solderability of Materials and Electronic Components\",\"authors\":\"V. L. Lanin,&nbsp;V. A. Emel’yanov,&nbsp;I. B. Petuhov\",\"doi\":\"10.3103/S1068375524700030\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>The concept of solderability is rigorously defined, accompanied by the proposal of quantitative criteria for its assessment. A comprehensive categorization of solderable materials into three distinct groups—namely, easily solderable, moderately solderable, and unsolderable—is proposed based on solderability parameters. Practical recommendations are given for the effective deployment of solderability testing methodologies across a spectrum of materials and electronic components. Detailed expositions are offered on the methods employed in the evaluation of solderability, encompassing solder immersion, measurement of solder spreading area, and assessment of capillary penetration into gaps. Schematic representations of these evaluation techniques, alongside descriptions of the requisite apparatus for their implementation, are presented. Furthermore, tabulated data on the solder spreading factors for diverse categories of chemical and electroplated coatings, including hot tinning, are given. Prolonged storage may lead to the formation of oxide films on the surface of coatings, thereby deteriorating solderability. To enhance the quality of electroplated coatings, it is recommended to employ periodic currents in nonstationary electrolysis modes during the deposition of electroplated coatings.</p>\",\"PeriodicalId\":782,\"journal\":{\"name\":\"Surface Engineering and Applied Electrochemistry\",\"volume\":\"60 3\",\"pages\":\"317 - 331\"},\"PeriodicalIF\":0.9000,\"publicationDate\":\"2024-09-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Surface Engineering and Applied Electrochemistry\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://link.springer.com/article/10.3103/S1068375524700030\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Surface Engineering and Applied Electrochemistry","FirstCategoryId":"1085","ListUrlMain":"https://link.springer.com/article/10.3103/S1068375524700030","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0

摘要

摘要 严格定义了可焊性的概念,并提出了评估可焊性的量化标准。根据可焊性参数,将可焊材料全面分为三类--即易焊、中度可焊和不可焊。为在各种材料和电子元件中有效使用可焊性测试方法提供了实用建议。详细阐述了评估可焊性所采用的方法,包括焊料浸入、焊料扩散面积测量和毛细管渗透缝隙评估。在介绍这些评估技术的示意图的同时,还说明了实施这些技术所需的仪器。此外,还提供了各类化学和电镀涂层(包括热镀锡)的焊料扩散系数的表格数据。长期储存可能会导致涂层表面形成氧化膜,从而降低可焊性。为提高电镀涂层的质量,建议在电镀涂层沉积过程中采用非稳态电解模式的周期性电流。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Chapter 3. Solderability of Materials and Electronic Components

The concept of solderability is rigorously defined, accompanied by the proposal of quantitative criteria for its assessment. A comprehensive categorization of solderable materials into three distinct groups—namely, easily solderable, moderately solderable, and unsolderable—is proposed based on solderability parameters. Practical recommendations are given for the effective deployment of solderability testing methodologies across a spectrum of materials and electronic components. Detailed expositions are offered on the methods employed in the evaluation of solderability, encompassing solder immersion, measurement of solder spreading area, and assessment of capillary penetration into gaps. Schematic representations of these evaluation techniques, alongside descriptions of the requisite apparatus for their implementation, are presented. Furthermore, tabulated data on the solder spreading factors for diverse categories of chemical and electroplated coatings, including hot tinning, are given. Prolonged storage may lead to the formation of oxide films on the surface of coatings, thereby deteriorating solderability. To enhance the quality of electroplated coatings, it is recommended to employ periodic currents in nonstationary electrolysis modes during the deposition of electroplated coatings.

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来源期刊
Surface Engineering and Applied Electrochemistry
Surface Engineering and Applied Electrochemistry Engineering-Industrial and Manufacturing Engineering
CiteScore
1.60
自引率
22.20%
发文量
54
期刊介绍: Surface Engineering and Applied Electrochemistry is a journal that publishes original and review articles on theory and applications of electroerosion and electrochemical methods for the treatment of materials; physical and chemical methods for the preparation of macro-, micro-, and nanomaterials and their properties; electrical processes in engineering, chemistry, and methods for the processing of biological products and food; and application electromagnetic fields in biological systems.
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