用于铁磁钢缺陷检测的磁头式涡流阵列

IF 4.1 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Sensors and Actuators A-physical Pub Date : 2024-09-11 DOI:10.1016/j.sna.2024.115862
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引用次数: 0

摘要

铁磁钢表面和次表面的缺陷很容易导致结构失效。涡流检测是最常用的缺陷检测技术之一。本文将直流(DC)磁化与磁头涡流阵列(MHECA)相结合,提出了 DCMHECA 技术。该方法可以解决单探头检测效率低和阵列检测通道复用的问题,同时还能检测深层表面和地下缺陷。实验结果验证了所提出的 DCMHECA 可用于定位矩形和孔洞缺陷并量化其深度,且通道干扰小,差值率低。
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A magnetic head-based eddy current array for defect detection in ferromagnetic steels

Defects on the surface and subsurface of the ferromagnetic steels can easily lead to structural failures. Eddy current testing is one of the most popular techniques for defect detection. In this paper, the direct current (DC) magnetization and a magnetic head-based eddy current array (MHECA) are integrated to propose the DCMHECA technique. This method can address the low testing efficiency of single probe testing and the channel multiplexing of array testing, and meanwhile detect deep surface and subsurface defects. The experimental results verify that the proposed DCMHECA can be used to locate rectangular and hole defects and quantify their depths with little channel interferences, which are indicated by low difference rates.

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来源期刊
Sensors and Actuators A-physical
Sensors and Actuators A-physical 工程技术-工程:电子与电气
CiteScore
8.10
自引率
6.50%
发文量
630
审稿时长
49 days
期刊介绍: Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas: • Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results. • Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon. • Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays. • Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers. Etc...
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