使用考虑铜粗糙度的带状线确定印刷电路板电介质的脆度

0 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE microwave and wireless technology letters Pub Date : 2024-08-23 DOI:10.1109/LMWT.2024.3443768
Juan P. Sánchez-Muñoz;Svetlana C. Sejas-García;Chudy Nwachukwu;Reydezel Torres-Torres
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引用次数: 0

摘要

印刷电路板层压板的相对介电常数是通过条纹实验得到的传播常数确定的。为此,通过应用一个方程来消除电磁场与导体表面之间的相互作用所带来的延迟效应,从而获得与介质介质相关的相位常数。与以往的方法不同,无需事先了解特性阻抗或电磁模拟支持。当分别考虑不同条纹阵列中的单端、差分和共模传播数据时,可获得一致的结果,最高可达 50 GHz。此外,通过应用多极德拜模型,还可从获得的介电常数推断介质损耗正切。
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Determining the Permittivity of a PCB Dielectric Using Striplines Considering Copper Roughness
The relative permittivity of printed circuit board laminates is determined from the experimental propagation constant obtained from striplines. For this aim, the phase constant associated with the dielectric media is obtained by applying an equation that removes the delay effect introduced by the interaction between the electromagnetic field and the conductor surface. Unlike previous approaches, no previous knowledge of the characteristic impedance or support from electromagnetic simulations is required. Consistent results are obtained when separately considering single-ended, differential, and common mode propagation data in different arrays of striplines up to 50 GHz. Furthermore, the dielectric loss tangent is inferred from the obtained permittivity by applying a multipole Debye model.
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