金属增材制造:原理与应用

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Journal of Manufacturing Processes Pub Date : 2024-10-02 DOI:10.1016/j.jmapro.2024.09.101
S. Patel, Y. Liu, Z. Siddique, I. Ghamarian
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引用次数: 0

摘要

金属快速成型制造(AM)具有无需工具、产品开发接近净形、制造时间短、不受产品尺寸限制等显著特点,因而受到广泛关注。本文简要介绍了常见的金属 AM 工艺,包括粉末床熔融、粘合剂喷射、定向能沉积和薄片层压。本文通过实例对每种金属 AM 技术的优势和局限性进行了比较和论述。针对每种金属 AM 方法,讨论了确保成功 3D 打印金属结构的关键步骤。对每个加工参数的影响进行了批判性分析,以提高制造特性。讨论了金属 AM 机制、加工参数优化、粉末制备技术及其对粉末形态的影响,以及金属 AM 的应用。
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Metal additive manufacturing: Principles and applications
Additive manufacturing (AM) of metals has gained massive attention due to its salient features, such as a tool-free process, near-net shape product development, less fabrication time, and no restriction on product size. This paper provides a brief overview of common metal AM processes, including powder bed fusion, binder jetting, directed energy deposition, and sheet lamination. The advantages of each metal AM technology and their limitations are compared and addressed with examples. Critical steps to ensure the successful 3D printing of metal structures are discussed for each metal AM approach. The effect of each processing parameter is critically analyzed to enhance fabrication characteristics. The metal AM mechanisms, optimization of processing parameters, powder preparation techniques and their effects on the powder morphology, and applications of metal AM are discussed.
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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