通过 SILAR 方法合成的无粘结剂氧化镍、铜和掺钴氧化镍薄膜在室温下增强的氨气传感性能

IF 4.3 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Chemistry and Physics Pub Date : 2024-10-22 DOI:10.1016/j.matchemphys.2024.130065
Maruti B. Kumbhar , Vaishali S. Chandak , Prakash M. Kulal
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引用次数: 0

摘要

我们全面分析了 Cu 和 Co 掺杂对氧化镍薄膜的结构、成分、光学和氨传感特性的影响。X 射线衍射分析表明,纯 NiO、Cu 和 Co 掺杂的 NiO 薄膜具有立方结构。值得注意的是,掺杂 Co 引起了氧化镍晶粒大小和表面结构的变化。这种变化最终增强了掺钴氧化镍薄膜的传感能力。钴的存在降低了激活掺钴氧化镍所需的能量,从而增强了掺钴样品的传感能力,可检测百万分之 50 的氨气,响应时间为 20 秒,恢复时间为 16 秒,响应百分比为 76.25%。掺杂 Co 的氧化镍传感器对氨的响应性和选择性的增强可归因于其表面积的增大、晶体尺寸的减小以及优异的表面特性。掺钴氧化镍薄膜取得的卓越成果表明,它有望用于生产高效的氨气检测设备。
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Enhanced ammonia gas sensing performance at room temperature of binder-free NiO, Cu and Co-doped NiO thin films synthesized via the SILAR method
We have comprehensively analyzed the influence of Cu and Co-doping on the structural, compositional, optical, and ammonia sensing characteristics of NiO thin films. The X-ray diffraction analysis revealed that pure NiO, Cu, and Co-doped NiO thin films possess a cubic structure. Remarkably, the Co-dopant caused a transformation in the crystallite size and surface structure of NiO. This alteration ultimately enhanced the sensing capabilities of Co-doped NiO thin films. The presence of Co decreased the amount of energy needed to activate Co-doped NiO, resulting in enhanced sensing capabilities of the doped samples for detecting 50 parts per million of ammonia with a response time of 20 s and recovery time of 16 s and having a percentage response of 76.25 %. The enhanced sensor responsiveness and selectivity of the Co-doped NiO sensor towards ammonia can be attributed to its increased surface area, smaller crystallite sizes, and superior surface properties. The remarkable results of Co-doped NiO thin films exhibited show a potential for use in the production of highly efficient ammonia gas-detecting devices.
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来源期刊
Materials Chemistry and Physics
Materials Chemistry and Physics 工程技术-材料科学:综合
CiteScore
8.70
自引率
4.30%
发文量
1515
审稿时长
69 days
期刊介绍: Materials Chemistry and Physics is devoted to short communications, full-length research papers and feature articles on interrelationships among structure, properties, processing and performance of materials. The Editors welcome manuscripts on thin films, surface and interface science, materials degradation and reliability, metallurgy, semiconductors and optoelectronic materials, fine ceramics, magnetics, superconductors, specialty polymers, nano-materials and composite materials.
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