电子束蒸发制备Cu-Ni合金薄膜的过程

IF 0.1 Q4 MULTIDISCIPLINARY SCIENCES DOKLADY NATSIONALNOI AKADEMII NAUK BELARUSI Pub Date : 2023-05-07 DOI:10.29235/1561-8323-2023-67-2-156-162
S. Chizhik, V. Zelenin, Y. Yahorava
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引用次数: 0

摘要

考虑了电子束蒸发形成Cu–Ni合金薄膜的特点。确定了在真空蒸发过程中铜和镍的总压力的等压线在铜-镍状态图上的位置。对薄膜的元素组成进行了计算。结果表明,Cu50Ni50合金在真空沸腾过程中沉积的薄膜中的镍含量是合金中镍含量的50倍。研究了合金蒸发和升华后表面层的结构和元素组成,以及沉积膜的元素组成。研究表明,在Cu–Ni体系中获得稳定组成薄膜的最可接受的方法是从两个坩埚中同时用电子束蒸发铜和镍。
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Processes of formation of Cu–Ni alloy films by electron beam evaporation
The features of the formation of Cu–Ni alloy films by electron beam evaporation are considered. The position of the isobars of the total pressure of copper and nickel on the state diagram of the Cu–Ni during evaporation in vacuum is determined. Calculations of the elemental compositions of films have been carried out. It is shown that the nickel content in films deposited during boiling of Cu50Ni50 alloy in vacuum is 50 times less than in the alloy. The structure and elemental composition of the surface layer of alloys after their evaporation and sublimation, as well as the elemental composition of the deposited films, are investigated. It is shown that the most acceptable way to obtain films of stable composition in the Cu–Ni system is simultaneous electron beam evaporation of copper and nickel from two crucibles. 
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DOKLADY NATSIONALNOI AKADEMII NAUK BELARUSI
DOKLADY NATSIONALNOI AKADEMII NAUK BELARUSI MULTIDISCIPLINARY SCIENCES-
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