IF 1.8 3区 材料科学Q2 MATERIALS SCIENCE, CHARACTERIZATION & TESTINGStrainPub Date : 2021-09-13DOI:10.1111/str.12401
K. Nwanoro, P. Harrison, F. Lennard
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Investigating the accuracy of digital image correlation in monitoring strain fields across historical tapestries
Finite element generated synthetic image deformation is used to assess factors affecting the reliability and accuracy of strain fields measured by the DIC technique, when using the inherent historical tapestry image to track deformations. Compared with direct correlation with the reference image, incremental correlation is found to introduce accumulated error and is less suitable for DIC analysis under low strains. Image quality, for example, variation in resolution, is demonstrated to strongly affect DIC performance. Finally, it is recommended that an iterative approach is required to determine the optimum subset and strain filter size for effective DIC analysis using inherent tapestry patterns, especially at low strain levels.
期刊介绍:
Strain is an international journal that contains contributions from leading-edge research on the measurement of the mechanical behaviour of structures and systems. Strain only accepts contributions with sufficient novelty in the design, implementation, and/or validation of experimental methodologies to characterize materials, structures, and systems; i.e. contributions that are limited to the application of established methodologies are outside of the scope of the journal. The journal includes papers from all engineering disciplines that deal with material behaviour and degradation under load, structural design and measurement techniques. Although the thrust of the journal is experimental, numerical simulations and validation are included in the coverage.
Strain welcomes papers that deal with novel work in the following areas:
experimental techniques
non-destructive evaluation techniques
numerical analysis, simulation and validation
residual stress measurement techniques
design of composite structures and components
impact behaviour of materials and structures
signal and image processing
transducer and sensor design
structural health monitoring
biomechanics
extreme environment
micro- and nano-scale testing method.