PCB板温度场的分数阶状态空间模型

IF 1 Q4 ENGINEERING, MECHANICAL Acta Mechanica et Automatica Pub Date : 2023-03-19 DOI:10.2478/ama-2023-0020
K. Oprzȩdkiewicz, W. Mitkowski, M. Rosół
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引用次数: 0

摘要

本文讨论了二维金属表面温度场的分数阶状态空间模型。所提出的模型是传热过程模型的一维分数阶状态空间的二维推广。它使用沿时间和长度的分数导数。与使用整数阶导数的模型相比,所提出的模型在较低阶下确保了更好的精度。分析了该模型的基本性质。利用工业热像仪的数据对理论结果进行了实验验证。
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Fractional Order, State Space Model of the Temperature Field in the PCB Plate
Abstract In the paper the fractional order, state space model of a temperature field in a two-dimensional metallic surface is addressed. The proposed model is the two dimensional generalization of the one dimensional, fractional order, state space of model of the heat transfer process. It uses fractional derivatives along time and length. The proposed model assures better accuracy with lower order than models using integer order derivatives. Elementary properties of the proposed model are analysed. Theoretical results are experimentally verifed using data from industrial thermal camera.
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来源期刊
Acta Mechanica et Automatica
Acta Mechanica et Automatica ENGINEERING, MECHANICAL-
CiteScore
1.40
自引率
0.00%
发文量
45
审稿时长
30 weeks
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