硫酸盐还原菌对脱粘涂层下金属腐蚀行为影响的实验研究

IF 1.5 Q4 ELECTROCHEMISTRY International Journal of Corrosion Pub Date : 2017-10-23 DOI:10.1155/2017/9740817
Qing-Miao Ding, Li-Chun Fang, Yanyu Cui, Yujun Wang
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引用次数: 4

摘要

利用矩形脱粘涂层模拟装置,采用电化学方法研究了硫酸盐还原菌(SRB)对脱粘涂层下金属腐蚀行为的影响。结果表明,无论溶液中是否含有SRB,同一测试点的金属自腐蚀电位在实验初期变化不大。在腐蚀后期,有SRB的溶液中的电位幅度大于没有SRB的。在有或没有SRB的溶液中,同一测试点的金属腐蚀电流密度随着时间的推移逐渐增加,SRB可以加速金属在剥离缝隙中的腐蚀。添加杀菌剂后,SRB溶液环境中缝隙中的金属自腐蚀电位变化不大,但腐蚀电流密度显著降低。这意味着添加杀菌剂后SRB的生长和繁殖受到抑制,因此金属腐蚀速率减慢。在三种溶液环境中,增加涂层剥离厚度会加速缝隙中金属的腐蚀,其中SRB溶液中的腐蚀最大。
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Experimental Study on the Influence of Sulfate Reducing Bacteria on the Metallic Corrosion Behavior under Disbonded Coating
A rectangle disbonded coating simulation device was used to research the effect of sulfate reducing bacteria (SRB) on the metallic corrosion behavior under disbonded coating by the electrochemical method. The results showed that the metal self-corrosion potential at the same test point had little change in the initial experiment stage, whether the solution was without or with SRB. The potential amplitude in the solution with SRB was larger than that without SRB in the later corrosion period. The corrosion current density of the metal at the same test point increased gradually over time in the solution with or without SRB, and SRB could accelerate the corrosion of the metal in the disbonded crevice. The metal self-corrosion potential in the crevice had little change in the SRB solution environment after adding the fungicide, but the corrosion current density decreased significantly. That meant the growth and reproduction of SRB were inhibited after adding the fungicide, so the metal corrosion rate slowed down. Among the three kinds of solution environment, increasing the coating disbonded thickness could accelerate the corrosion of the metal in the crevice, and it was the largest in the solution with SRB.
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来源期刊
CiteScore
5.70
自引率
0.00%
发文量
8
审稿时长
14 weeks
期刊最新文献
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