电沉积Zn-Sn合金的阳极行为

IF 1.2 4区 材料科学 Q4 ELECTROCHEMISTRY Transactions of The Institute of Metal Finishing Pub Date : 1998-01-01 DOI:10.1080/00202967.1998.11871228
V. Ivanova, G. Raichevski, V. Krastev, S. Vitkova
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引用次数: 2

摘要

本文讨论了在0.5M Na2SO4和5% NaCI中电沉积Zn-15% sn合金的阳极行为,并与纯Zn镀层进行了比较。在0.5M Na2SO4介质中,合金呈现钝化状态,而在5% nai介质中,合金未呈现钝化状态。在活性态阳极极化作用下,研究了Zn-Sn镀层在0.5 M Na2SO4和5% NaCI介质中的选择性溶解。某些合金成分的强选择性溶解尚未确定。采用x射线光电子能谱(XPS)研究了0.5 M Na2SO4阳极处理后ZnSn涂层表面形成的元素和化学成分。表层锡逐渐富集。研究了0.5 M Na2SO4中不同腐蚀电化学处理对电偶合金组织和形貌的影响。
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Anodic behaviour of electrodeposited Zn-Sn alloys
SummaryThe paper discusses the anodic behaviour of the electrodeposited alloys Zn-15%Sn in comparison with pure Zn coatings in 0.5M Na2SO4 and 5% NaCI. A passive state in 0.5M Na2SO4 medium was registered for the alloy while in 5% NaCI the typical passive state was not observed. The selective dissolution of Zn-Sn coatings in media of 0.5 M Na2SO4, and 5% NaCI under the effect of anodic polarisation in the active state was investigated. Strong selective dissolution of some of the alloy components was not established.The elemental and chemical compositions of the surface layers formed on ZnSn coatings after anodic treatment in 0.5 M Na2SO4 were studied by X-ray photoelectron spectroscopy (XPS). A gradual tin-enrichment of the surface layer was established.The changes in the structure and morphology of the studied galvanic alloy in 0.5 M Na2SO4 under the influence of different corrosion-electrochemical treatments were investigated.
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来源期刊
Transactions of The Institute of Metal Finishing
Transactions of The Institute of Metal Finishing 工程技术-材料科学:膜
CiteScore
3.40
自引率
10.50%
发文量
62
审稿时长
3 months
期刊介绍: Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.
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