室内环境对冷藏陈列柜内食品包装温度影响的数值模拟

IF 1.9 4区 工程技术 Q3 ENGINEERING, MECHANICAL Advances in Mechanical Engineering Pub Date : 2013-01-01 DOI:10.1155/2013/708785
Chang Zhijuan, Wu Xuehong, Lu Yanli, Ma Qiuyang, Z. Wenhui
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引用次数: 15

摘要

为了研究食品包装温度与周围环境的关系,通过数值模拟研究了蒸发器出口速度、环境温度和相对湿度等不同条件下的食品包装温度。在本计算中,考虑了传质和辐射的影响。计算结果表明,由于光的影响,食品包装前部和顶部的温度上升到0.1 ~ 1.2℃。在本文的研究范围内,食品包装温度随着气幕速度的增大而降低,但随着环境温度和湿度的增大,食品包装温度也随之升高。同时,风幕出口速度每增加0.15 m/s,食品包装温度降低0.2 ~ 1.1℃。环境温度每升高2℃,食品包装温度升高约0.6℃。环境湿度每增加20%,食品包装温度会升高0.9℃左右。因此,本研究可为冷藏展示柜的设计提供参考。
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Numerical Simulation on the Food Package Temperature in Refrigerated Display Cabinet Influenced by Indoor Environment
In order to study the relation between the food package temperature and ambient environment, the food package temperature is investigated by numerical simulation under the different conditions, such as evaporator outlet velocities, ambient temperatures, and relative humidity. In the present computation, the influence of mass transfer and radiation is considered. The computational results show that the front and top food package temperature rises to 0.1 ~ 1.2°C due to the effect of light. At the investigated range of this paper, the food package temperature decreases when the air curtain velocity increases, but the food package temperature also increases with increase of ambient temperature and humidity. At the same time, the food package temperature decreases 0.2 ~ 1.1°C when air curtain outlet velocity increased by 0.15 m/s. The food package temperature rises about 0.6°C when ambient temperature increases by 2°C. The food package temperature rises about 0.9°C when ambient humidity increases by 20%. Therefore, the study can provide the reference for the design of refrigerated display cabinet.
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来源期刊
Advances in Mechanical Engineering
Advances in Mechanical Engineering 工程技术-机械工程
CiteScore
3.60
自引率
4.80%
发文量
353
审稿时长
6-12 weeks
期刊介绍: Advances in Mechanical Engineering (AIME) is a JCR Ranked, peer-reviewed, open access journal which publishes a wide range of original research and review articles. The journal Editorial Board welcomes manuscripts in both fundamental and applied research areas, and encourages submissions which contribute novel and innovative insights to the field of mechanical engineering
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