《智能集成电路设计与传感技术》特刊

G. Floros, A. Tziouvaras
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引用次数: 0

摘要

近年来,智能传感技术及其固有的数据处理技术引起了广泛的研究和工业界的关注。纳米CMOS技术的最新发展显示出巨大的潜力,可以应对从物联网应用到复杂医疗设备等这些传感技术中对处理能力日益增长的需求。此外,电路的实现可以基于完全模拟或数字方法,或在大多数情况下基于混合信号方法,在利用传感技术的全部能力方面具有根本作用。此外,所有电路设计方法都包括几个性能指标的优化,如低功耗、低成本、小面积和高吞吐量,这对传感器设计领域提出了关键挑战。本期特刊旨在强调传感技术集成电路的开发、建模、仿真和实现方面的进展,从组件级到完整的传感系统。
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Special Issue “Smart IC Design and Sensing Technologies”
Smart sensing technologies and their inherent data-processing techniques have drawn considerable research and industrial attention in recent years. Recent developments in nanometer CMOS technologies have shown great potential to deal with the increasing demand of processing power that arises in these sensing technologies, from IoT applications to complicated medical devices. Moreover, circuit implementation, which could be based on a full analog or digital approach or, in most cases, on a mixed-signal approach, possesses a fundamental role in exploiting the full capabilities of sensing technologies. In addition, all circuit design methodologies include the optimization of several performance metrics, such as low power, low cost, small area, and high throughput, which impose critical challenges in the field of sensor design. This Special Issue aims to highlight advances in the development, modeling, simulation, and implementation of integrated circuits for sensing technologies, from the component level to complete sensing systems.
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