真空绝热板的替代低成本核心系统

Flávia A. Almeida , Jorge Corker , Nuno Ferreira , Miguel A. Neto , Mizi Fan , Hermann Beyrichen , Roland Caps
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引用次数: 6

摘要

真空隔热板(VlP)目前被认为是最有前途的最先进的建筑隔热解决方案之一。基于其导热系数约为4 mW/(m K),厚度低于40 mm,它们在接近零能耗建筑(nZEB)以及高绝缘标准和节省生活空间至关重要的应用中具有巨大的潜力。然而,对于大多数业主和承包商来说,VIP仍然负担不起(高达100欧元/平方米),主要是由于使用传统气相二氧化硅作为核心材料的成本,以确保建筑应用的长使用寿命要求。本研究介绍了针对建筑市场的VIP设计的替代核心的早期发展。采用的策略是用更便宜的天然无机/有机轻质材料取代气相二氧化硅,或者通过创建多材料纳米结构复合基质。根据不同成分的物理、化学和形态特征以及各自的导热系数等级进行了分析。当气体压力低于10毫巴(1千帕)时,lambda值可低至5.3 mW/(m K)。预计这些新型核心系统将能够以更合理的成本抑制不同的传热机制,而不是目前的VIP气相二氧化硅核心系统。
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Alternative low cost based core systems for vacuum insulation panels

Vacuum Insulation Panels (VlP) are presently regarded as one of the most promising state-of-the-art building insulation solutions. Based on their thermal conductivities of about 4 mW/(m K), with a thickness below 40 mm, they have a great potential for near zero-energy buildings (nZEB) and for applications where high insulation standards and living space savings are crucial. However, VIP are still unaffordable for the majority of homeowners and contractors (up to 100 €/m2), mostly due to the cost of the conventional fumed silica used as core material to secure the long service life requirements of building applications. This study presents the early developments of alternative cores engineered for VIP targeting the building market. The adopted strategy is to replace fumed silica with cheaper natural inorganic/organic lightweight materials or, alternatively, by creating multimaterial nanostructured composite matrices. The different compositions were analysed according to their physical, chemical and morphological characteristics and their respective thermal conductivity ranks. Promising lambda values as low as 5.3 mW/(m K) have been achieved for gas pressures below 10 mbar (1 kPa). It is expected that these novel core systems will be capable of suppressing the different heat transfer mechanisms at more reasonable costs than the current VIP fumed silica ones.

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