共晶Sn-3.5 wt % Ag合金的热学、电学、显微组织和显微硬度性能

F. Meydaneri, B. Saatçi, M. Özdemir
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引用次数: 1

摘要

Sn-3.5wt的导热系数随温度的变化。采用径向热流仪对%Ag共晶合金进行了测量。固相导热系数为84.60±0.09 WK−1 m−1,温度系数为5.92× 10−4 K−1。用差示扫描量热计(DSC)从共晶固体向共晶液体转变过程的热流曲线测定了熔合焓(∆H)和比热(Cp)值。Sn-3.5wt电导率随温度的变化。根据Wiedemann-Franz定律,用测得的导热系数测定了%Ag共晶合金。显微硬度Sn-3.5wt。用维氏显微硬度仪对%Ag共晶合金在大约5个不同的点进行了测量。Sn-3.5wt的显微组织。采用扫描电镜(SEM)和能量色散x射线(EDX)对%Ag共晶合金进行了研究。可用于金属及合金、电阻率/电导率、显微组织、热力学、硬度测试
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Thermal, electrical, microstructure and microhardness properties of the eutectic Sn-3.5 wt % Ag alloy
The variation of thermal conductivity with temperature for Sn-3.5wt.%Ag eutectic alloy was measured with a radial heat flow apparatus. The thermal conductivity of the solid phase and temperature coefficient were also found to be 84.60 ± 0.09 WK−1 m−1 and 5.92× 10−4 K−1, respectively. The values of enthalpy of fusion (∆H ) and the specific heat (Cp) were also determined by differential scanning calorimeter (DSC) from heat flow curves during the transformation from eutectic solid to eutectic liquid. The variation of electrical conductivity with temperature for Sn-3.5wt.%Ag eutectic alloy was determined from the Wiedemann-Franz law by using the measured values of thermal conductivity. The microhardness of Sn-3.5wt.%Ag eutectic alloy was measured at approximately 5 different points with Vickers microhardness device. The microstructure of Sn-3.5wt.%Ag eutectic alloy was investigated by using scanning electron microscopy (SEM) and energy dispersive X-ray (EDX) analysis. K e y w o r d s: metals & alloys, electrical resistivity/conductivity, microstructure, thermodynamics, hardness test
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