磁热钆元素气溶胶沉积制备氧化铝防护涂层

IF 0.6 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Informacije Midem-Journal of Microelectronics Electronic Components and Materials Pub Date : 2019-12-09 DOI:10.33180/infmidem2019.306
Matej Šadl, Urban Tomc, Uroš Prah, H. Uršič
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引用次数: 7

摘要

本文研究了在磁热钆元素上制备保护性绝缘氧化铝涂层的方法。为了在室温下制备致密的陶瓷涂层,采用了气溶胶沉积技术。研究表明,粉末的形貌和粒度是影响沉积效率、粉末堆积,进而影响氧化铝涂层密度和功能性能的重要参数。最佳的粉末预沉积处理包括将粉末加热到1150°C,然后进行研磨。该粉末的沉积制备了致密的氧化铝涂层,其比电导率为6.4∙10−14 Ω−1 m−1。
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Protective Alumina Coatings Prepared by Aerosol Deposition on Magnetocaloric Gadolinium Elements
: In this work the preparation of a protective insulating alumina coating on magnetocaloric gadolinium elements was investigated. In order to prepare a dense ceramic coating at room temperature the aerosol deposition technique was used. The study reveals that the powder morphology and particle size are important parameters that influence the deposition efficiency, powder packing and consequently also the density and functional properties of the alumina coating. The optimal powder pre-deposition treatment includes heating the powder to 1150 °C, followed by milling. The deposition of this powder resulted in the preparation of dense alumina coatings with a low specific electrical conductivity of 6.4∙10 −14 Ω −1 m −1 .
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来源期刊
CiteScore
1.80
自引率
0.00%
发文量
10
审稿时长
>12 weeks
期刊介绍: Informacije MIDEM publishes original research papers in the fields of microelectronics, electronic components and materials. Review papers are published upon invitation only. Scientific novelty and potential interest for a wider spectrum of readers is desired. Authors are encouraged to provide as much detail as possible for others to be able to replicate their results. Therefore, there is no page limit, provided that the text is concise and comprehensive, and any data that does not fit within a classical manuscript can be added as supplementary material. Topics of interest include: Microelectronics, Semiconductor devices, Nanotechnology, Electronic circuits and devices, Electronic sensors and actuators, Microelectromechanical systems (MEMS), Medical electronics, Bioelectronics, Power electronics, Embedded system electronics, System control electronics, Signal processing, Microwave and millimetre-wave techniques, Wireless and optical communications, Antenna technology, Optoelectronics, Photovoltaics, Ceramic materials for electronic devices, Thick and thin film materials for electronic devices.
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