Chiung-Ying Kuo, H. Kuo, Ming-Fong Jhong, Chen-Chao Wang
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A Study of Material Extraction and Moisture Effect on mmWave Fan-out Package Design
In order to ensure the performance of high-frequency fan-out package design, especially at mmWave application, the influence of substrate dielectric characteristic is very serious. Polyimide (PI) material is common material used in Fan-out package. The moisture effect of PI is very obvious in stress and electrical performance. Sso this paper introduces the method of dielectric constant (Dk) and dissipation factor (Df) extraction. And then the moisture effect on transmission line loss and phase are also studied in this paper, the frequency is up to mmWave range.
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