5G毫米波基板集成波导系列馈电贴片天线

A. Azzawi, M. Rahim, O. Ayop, Y. M. Hussein
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引用次数: 1

摘要

本文对微带串联馈电贴片天线阵列与带气孔的基板集成波导串联馈电天线阵列进行了比较。采用CST studio仿真软件对Roger 5880衬底进行仿真,衬底的介电常数为2.22,厚度为0.508 mm,正切损耗为0.0009。天线被设计为在26千兆赫谐振。研究了天线的回波损耗、增益和辐射方向图等参数。本文还研究了在特定研究条件下,采用特定尺寸穿透并沿天线沿线分布的空气通孔基板来提高旁瓣电平的技术。
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Substrate Integrated Waveguide Series Feed Patch Antenna at Millimeter wave for 5G application
This paper presents the comparison between microstrip series feed patch antenna array and substrate integrated waveguide series feed antenna array with air vias. The CST studio simulation software is used for the simulation with Roger 5880 substrate where the dielectric permittivity of the substrate is 2.22 with a thickness of 0.508 mm and tangent loss of 0.0009. The antenna is designed to resonate at 26 GHz. Various parameters of the antenna have been investigated such as return loss, gain and radiation pattern. The technique to enhance the sidelobe level is also investigated by applying the air vias substrate that's achieved by penetrating at specific dimensions and distributed along line with the antennas by specific studied conditions.
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