Electrochemical behaviour of copper–silver alloys in sodium carbonate aqueous solution

Abstract The electrochemical behaviour of Cu–20 wt-%Ag and Cu–80 wt-%Ag alloys was studied in aerated Na2 CO3 solutions using cyclic voltammetry, potentiodynamic anodic polarisation, and current transient techniques. The microstructure of the compounds formed on the surface of the alloy during the anodic potential sweep was obtained using XRD analysis. The dissolution behaviour of either of the two constituents from the alloys resembles that of the pure state. The galvanic coupling effect enhances the dissolution of the less noble metal, copper, on alloying with silver. The anodic sweep potential exhibited seven anodic peaks A1 , A2 , A3 , A4 , A5 , A6 , and A7 prior to the oxygen evolution reaction. These peaks are assigned to the formation of Cu2O, Cu(OH)2 , CuO, Ag2O, Ag2 CO3 , and Ag2O2 respectively. Potentiostatic current/time transients showed that the formation of Cu2O, CuO, Ag2O, and Ag2 CO3 layers involves a nucleation and growth mechanism under diffusion control.