首页 > 期刊列表> Proceedings of the 2005 conference on Applications, technologies, architectures, and protocols for computer communications - SIGCOMM '05

Proceedings of the 2005 conference on Applications, technologies, architectures, and protocols for computer communications - SIGCOMM '05

浏览量15
分享 分享
微信好友 朋友圈 QQ好友 复制链接
订阅订阅 查看最新文献查看最新文献
同类期刊
Proceedings of the 2005 conference on Applications, technologies, architectures, and protocols for computer communications - SIGCOMM '05

发文信息

同类期刊

Revista de Administração IMED
Revista de Administração IMED Proceedings of IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP '93)
Proceedings of IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP '93) Interactivity in D3
Interactivity in D3 Journal of Electrical, Electronic, Mechanical, Informatic and Social Applied Science
Journal of Electrical, Electronic, Mechanical, Informatic and Social Applied Science Writing for Nothing
Writing for Nothing Eletrônica de Potência
Eletrônica de Potência

Proceedings of the 2005 conference on Applications, technologies, architectures, and protocols for computer communications - SIGCOMM '05 - 最新文献

查看全部

HLP

Pub Date : 1900-01-01 DOI: 10.1145/1080091.1080095 L. Subramanian, M. Caesar, C. Ee, M. Handley, Morley Mao, Scott Shenker, I. Stoica
免责声明：
本页显示期刊或杂志信息，仅供参考学习，不是任何期刊杂志官网，不涉及出版事务，特此申明。如需出版一切事务需要用户自己向出版商联系核实。若本页展示内容有任何问题，请联系我们，邮箱：info@booksci.cn，我们会认真核实处理。
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们：info@booksci.cn
Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1