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2015 16th International Conference on Electronic Packaging Technology (ICEPT)

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2015 16th International Conference on Electronic Packaging Technology (ICEPT)

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2015 16th International Conference on Electronic Packaging Technology (ICEPT) - 最新文献

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A new method for reducing warpage due to reflow in IGBT module

Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236816 Yang Zhou, Ling Xu, Miaocao Wang, Z. Qian, Sheng Liu

The effects of Au film thickness on the reliability of Sn-Pb solder joints

Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236822 Xiaorui Lv, P. Lin, Yingzhuo Huang, X. Jiang, B. Lian, Quanbin Yao

Spot welding process research of fine pitch micro-rectangular connectors based on pu enameled wire

Pub Date : 2015-09-03 DOI: 10.1109/ICEPT.2015.7236567 Xiaole Kuang, Haibing Zhang, Wei Zhu, Xiaobai Xie
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