The experimental investigation and numerical simulation of self-healing in metallized film capacitors

V. Belko, O. Emelyanov, I. Ivanov
{"title":"The experimental investigation and numerical simulation of self-healing in metallized film capacitors","authors":"V. Belko, O. Emelyanov, I. Ivanov","doi":"10.1109/ICD.2016.7547530","DOIUrl":null,"url":null,"abstract":"Metallized film capacitors have an ability to withstand the breakdown of dielectric film due to a “self-healing” feature. The optimal design of metallized electrodes' patterns guarantees high reliability of metallized film capacitors. This paper presents the results of numerical simulation of the intersegment gate current destruction during self-healing by means of COMSOL Multiphysics software. The model takes into consideration the heat flow from metal layer to polymer film since it has significant influence on destruction process dynamics. The simulation results were shown to be in good agreement with the experimental data.","PeriodicalId":306397,"journal":{"name":"2016 IEEE International Conference on Dielectrics (ICD)","volume":" 27","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Conference on Dielectrics (ICD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICD.2016.7547530","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11

Abstract

Metallized film capacitors have an ability to withstand the breakdown of dielectric film due to a “self-healing” feature. The optimal design of metallized electrodes' patterns guarantees high reliability of metallized film capacitors. This paper presents the results of numerical simulation of the intersegment gate current destruction during self-healing by means of COMSOL Multiphysics software. The model takes into consideration the heat flow from metal layer to polymer film since it has significant influence on destruction process dynamics. The simulation results were shown to be in good agreement with the experimental data.
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金属化薄膜电容器自愈的实验研究与数值模拟
金属化薄膜电容器由于具有“自愈”特性而具有承受介电膜击穿的能力。金属化电极图案的优化设计保证了金属化薄膜电容器的高可靠性。本文利用COMSOL Multiphysics软件对自愈过程中栅极段间电流破坏进行了数值模拟。该模型考虑了从金属层到聚合物膜的热流,因为热流对破坏过程动力学有重要影响。仿真结果与实验数据吻合较好。
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