Damage-free top-down processes for fabricating two-dimensional array of sub-10-nanometer GaAs nanodiscs using bio-template and neutral beam etching for intermediate band solar cell applications

M. F. Budiman, Xuan-Yu Wang, Chi-Hsien Huang, R. Tsukamoto, T. Kaizu, M. Igarashi, P. Mortemousque, Y. Okada, A. Murayama, K. Itoh, Y. Ohno, S. Samukawa
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Abstract

A series of damage-free fabrication processes for a two-dimensional array of sub-10-nm GaAs nanodiscs was developed by using bio-templates and neutral beam etching. The photoluminescence of GaAs etched with a neutral beam clearly revealed that the processes could accomplish defect-free etching for GaAs. In the bio-template process, a hydrogen-radical treatment was used to remove the native oxide on the GaAs surface, and then neutral beam oxidation (NBO) was used to form a hydrophilic 1-nm-thick GaAs oxide (GaAs-NBO) film. The two-dimensional array of ferritins (protein including a 7-nm-diameter iron core) can be arranged well on hydrophilic GaAs-NBO film. The ferritin protein shell was removed using an oxygen-radical treatment at a low temperature of 280°C without thermal damage to the GaAs. Then, the neutral beam etched the the GaAs to form defect-free nanodisc structure of using the iron core as an etching mask. Finally, the iron oxide core was removed by wet etching with diluted hydrogen chloride and the fabrication process was completed without inflicting any damage to the GaAs. As a result, a two-dimensional array of GaAs quantum dots with a diameter of ∼7 nm, a height of ∼10 nm, a high taper angle of 88°, and a quantum dot density of more than 7×1011 cm−2 was successfully fabricated without causing any damage to the GaAs.
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采用生物模板和中性光束刻蚀技术制备亚10纳米GaAs纳米片二维阵列的自顶向下工艺,用于中波段太阳能电池
利用生物模板和中性光束刻蚀技术,开发了一系列亚10nm砷化镓纳米片二维阵列的无损伤制备工艺。中性束刻蚀砷化镓的光致发光结果表明,该工艺可以实现砷化镓的无缺陷刻蚀。在生物模板工艺中,采用氢自由基处理去除GaAs表面的天然氧化物,然后采用中性束氧化(NBO)形成亲水的1 nm厚的GaAs氧化物(GaAs-NBO)膜。在亲水性GaAs-NBO薄膜上,铁蛋白(含直径为7nm的铁核的蛋白质)可以很好地排列在二维阵列上。在280℃的低温下,氧自由基处理去除铁蛋白外壳,没有对砷化镓造成热损伤。然后,中性束以铁芯为蚀刻掩膜对砷化镓进行蚀刻,形成无缺陷的纳米圆盘结构。最后,用稀释的氯化氢湿法蚀刻去除氧化铁芯,在没有对砷化镓造成任何损伤的情况下完成了制造过程。结果,成功制备了直径为~ 7 nm,高度为~ 10 nm,高锥角为88°,量子点密度超过7×1011 cm−2的GaAs量子点二维阵列,而不会对GaAs造成任何损伤。
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