{"title":"The use of multichip module technology for power electronics miniaturization and packaging","authors":"K. Burgers, K. Olejniczak, S. Ang, E. Porter","doi":"10.1109/APEC.1997.581431","DOIUrl":null,"url":null,"abstract":"This paper describes the design and fabrication of a highly integrated, intelligent, integral horsepower, three-phase induction motor drive based on multichip module (MCM) technology. This solid-state controller-known as a multichip power module (MCPM)-uses known good die to obtain minimal footprint, volume, and mass, while maximizing efficiency, reliability, and manufacturability.","PeriodicalId":423659,"journal":{"name":"Proceedings of APEC 97 - Applied Power Electronics Conference","volume":"67 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-02-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of APEC 97 - Applied Power Electronics Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC.1997.581431","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper describes the design and fabrication of a highly integrated, intelligent, integral horsepower, three-phase induction motor drive based on multichip module (MCM) technology. This solid-state controller-known as a multichip power module (MCPM)-uses known good die to obtain minimal footprint, volume, and mass, while maximizing efficiency, reliability, and manufacturability.
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