Deep Structures Wet Etched Into Lithium Niobate Using A Physical Mask

A. Randles, B. Pokines, Shuji Tanaka, M. Esashi
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Abstract

The present work is an investigation and characterization of a new technique for etching and masking lithium niobate (LiNbO3) to realize high aspect ratio structures. LiNbO3 is a single crystal, optically clear (from 350 nanometer to 5 micrometer wavelength) piezoelectric and electro-optical material. It is inert to most reactants and has a high Curie temperature. These properties allow LiNbO3 to be used as a sensor or actuator in harsh environments or as an optical modulator. Multi-level lithium niobate deep etching techniques are currently unavailable or limited. The present work uses a chrome gold mask with a solution of hydrofluoric acid and nitric acid at 80 °C to etch the LiNbO3. The novel wet etch method developed yields an etch rate of 30 micrometer per hour on the -z face and less than 250 nm per hour on the +z face. In the experimentation done with this research trenches 80 micrometers deep were fabricated. Experimental etch and results are detailed.
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利用物理掩膜湿蚀刻铌酸锂深层结构
本文研究了一种新的蚀刻和遮蔽铌酸锂(LiNbO3)以实现高纵横比结构的技术。LiNbO3是一种单晶、光学透明(波长从350纳米到5微米)的压电和电光材料。它对大多数反应物是惰性的,并且具有很高的居里温度。这些特性允许LiNbO3在恶劣环境中用作传感器或致动器或用作光学调制器。多层铌酸锂深度蚀刻技术目前是不可用的或有限的。本工作使用铬金掩膜与80°C的氢氟酸和硝酸溶液来蚀刻LiNbO3。这种新型的湿式蚀刻方法在-z面上的蚀刻速率为30微米/小时,在+z面上的蚀刻速率小于250纳米/小时。在实验中,本研究制作了80微米深的沟槽。详细介绍了实验刻蚀和结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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