Convective Cooling Evaluation of Electronic Devices using Lock-in Thermography

Abstract

This paper presents the basis of dynamic thermography, with its application to thermal parameters evaluation. The method is based on windowed FFT analysis, with special attention paid for the phasegrams interpretation. A thermal modeling of the investigated object based on lumped RC network has been made to estimate the sensitivity and accuracy of the method. Heat transfer coefficient, thermal conductivity of the material, and thickness of multilayer structure are the major parameters that can be evaluated. The proposed approach can be used mainly for electronic applications.