Peter Russer, J. Russer, F. Mukhtar, Paolo Lugli, S. Wane, D. Bajon, W. Porod
{"title":"Integrated antennas for RF sensing, wireless communications and energy harvesting applications","authors":"Peter Russer, J. Russer, F. Mukhtar, Paolo Lugli, S. Wane, D. Bajon, W. Porod","doi":"10.1109/IWAT.2013.6518285","DOIUrl":null,"url":null,"abstract":"Silicon-based monolithic integrated millimeterwave circuits today facilitate the realization of millimeterwave communication and sensing systems [1], [2]. Monolithic integration of antennas into transmitter and receiver front ends reduces weight and costs of millimeterwave systems [3]. As the structure size of circuit devices and components is continuously decreasing the same will hold true for antennas and radiation elements used in integrated circuits for on-chip and chip-to-chip communication. An interesting option to overcome the bandwidth limitations for signal transmission on or between monolithic integrated circuits is wireless chip-to-chip and on-chip interconnects via integrated antennas. Instead of dedicating chip area for the antenna, the antenna can make use of the available on-chip metallization. Antenna-coupled thermal sensors offer a unique choice for infrared detection applications. A considerable size reduction of integrated antenna structures may be achieved using carbon nanotubes and graphene as the antenna material. Plasmonic nanostructures allow realizing ultra small antenna structures for detection applications.","PeriodicalId":247542,"journal":{"name":"2013 International Workshop on Antenna Technology (iWAT)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-03-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 International Workshop on Antenna Technology (iWAT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IWAT.2013.6518285","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
Silicon-based monolithic integrated millimeterwave circuits today facilitate the realization of millimeterwave communication and sensing systems [1], [2]. Monolithic integration of antennas into transmitter and receiver front ends reduces weight and costs of millimeterwave systems [3]. As the structure size of circuit devices and components is continuously decreasing the same will hold true for antennas and radiation elements used in integrated circuits for on-chip and chip-to-chip communication. An interesting option to overcome the bandwidth limitations for signal transmission on or between monolithic integrated circuits is wireless chip-to-chip and on-chip interconnects via integrated antennas. Instead of dedicating chip area for the antenna, the antenna can make use of the available on-chip metallization. Antenna-coupled thermal sensors offer a unique choice for infrared detection applications. A considerable size reduction of integrated antenna structures may be achieved using carbon nanotubes and graphene as the antenna material. Plasmonic nanostructures allow realizing ultra small antenna structures for detection applications.