Sub-Micron Patterning Titanium Nitride By Focused Ion-Beam Technique

Jianxia Gao, M. Chan-Park, D. Xie, B. Ngoi, C. Yue
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Abstract

Titanium nitride (TiN) thin films have low electrical resistivity, good chemical and metallurgical stability, and exceptional mechanical properties. As such, we are interested in exploring TiN for use as mold material for micro-and nano replication. Focused ion beam (FIB) technique was successfully used to fabricate sub-micron sized pattern on a TiN/Si(100) wafer. This mask-free fabrication technique takes advantage of the kinetic precision of FIB; the energy of ions used was 40 KeV. The width and depth of each trench in the TiN mold are 390 nm and 280 nm respectively.
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聚焦离子束亚微米图像化氮化钛技术
氮化钛(TiN)薄膜具有低电阻率、良好的化学和冶金稳定性以及优异的机械性能。因此,我们有兴趣探索TiN作为微纳米复制的模具材料。利用聚焦离子束(FIB)技术成功地在TiN/Si(100)晶圆上制备了亚微米尺寸的图案。这种无掩模制造技术利用了FIB的运动精度;所用离子能量为40kev。TiN模具中每条沟槽的宽度和深度分别为390 nm和280 nm。
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