Mitigation of conduction loss in a semi-crystalline polymer with high dielectric constant and high charge-discharge efficiency

Yash Thakur, Tian Zhang, Minren Lin, Q. Zhang, M. Lean
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引用次数: 1

Abstract

Dielectric materials with high electrical energy density, low loss, and high thermal stability are desirable for a broad range of modern power electronic systems. Here, we investigate the conduction mechanism at high temperatures and high fields in a semi-crystalline poly(tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride) (THV) terpolymer, which has been shown to be attractive for high temperature and high energy density capacitors. In order to suppress conduction at high temperature and high electric field, alumina (Al2O3) nanofillers were added to the THV polymer matrix. Experimental results show that the Al2O3 nanofillers are very effective in reducing the conduction current, and at 125°C nanocomposites exhibit more than two orders of magnitude reduction in conduction compared to the neat polymer. Continuum and particle simulations were carried out to understand the leakage conductivity, and simulation results agree very well with the measured data. Hopping conduction has been identified as the dominant conduction mechanism.
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降低高介电常数和高充放电效率半结晶聚合物的传导损耗
具有高电能密度、低损耗和高热稳定性的介电材料是广泛应用于现代电力电子系统的理想材料。在这里,我们研究了半晶聚(四氟乙烯-六氟丙烯-偏氟乙烯)(THV)三元共聚物(THV)在高温和高场下的传导机制,该共聚物已被证明是高温和高能量密度电容器的吸引力。为了抑制高温高电场下的导电,在THV聚合物基体中加入了氧化铝(Al2O3)纳米填料。实验结果表明,Al2O3纳米填料对降低导电电流非常有效,在125℃时,纳米复合材料的导电电流比纯聚合物降低了两个数量级以上。对泄漏电导率进行了连续体模拟和颗粒模拟,模拟结果与实测数据吻合较好。跳跃传导已被确定为主要的传导机制。
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