Unified texturization method for mono- and multi-crystalline silicon solar cells

Abstract

A texturization method suitable for both c- and mc-Si is developed. The method is applied on as-cut wafers and is found to be suitable for combined saw damage removal and texture formation. The texturization with inverted surface structures was obtained using wet chemistry process sequence at room temperatures without using a mask and lithography. Potential for an improvement of the standard screen — printing cells performance by incorporation of the new developed texturization method is demonstrated.