P. Brand, Y. Veschetti, V. Sanzone, R. Cabal, X. Pagès, K. Vanormelingen, P. Vermont
{"title":"Integration of aluminium oxide as a passivation layer in a high efficiency industrial process on n-type silicon solar cells","authors":"P. Brand, Y. Veschetti, V. Sanzone, R. Cabal, X. Pagès, K. Vanormelingen, P. Vermont","doi":"10.1109/PVSC.2011.6186127","DOIUrl":null,"url":null,"abstract":"This work aims at evaluating aluminium oxide (Al<inf>2</inf>O<inf>3</inf>) as an emitter passivation layer for Cz-silicon n-type solar cells fabricated with screen-printed metallization. The effect of firing on the emitter saturation current density obtained with Al<inf>2</inf>O<inf>3</inf>/SiN<inf>x</inf> was studied and compared to the one obtained with thermal SiO<inf>2</inf>/SiN<inf>x</inf>. An efficiency of 18.3% was achieved using Al<inf>2</inf>O<inf>3</inf> for n-type solar cells, still limited by a low fill factor due to a high contact resistance.","PeriodicalId":373149,"journal":{"name":"2011 37th IEEE Photovoltaic Specialists Conference","volume":"53 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 37th IEEE Photovoltaic Specialists Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PVSC.2011.6186127","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This work aims at evaluating aluminium oxide (Al2O3) as an emitter passivation layer for Cz-silicon n-type solar cells fabricated with screen-printed metallization. The effect of firing on the emitter saturation current density obtained with Al2O3/SiNx was studied and compared to the one obtained with thermal SiO2/SiNx. An efficiency of 18.3% was achieved using Al2O3 for n-type solar cells, still limited by a low fill factor due to a high contact resistance.