L. Fan, S. Gloeckner, P. D. Dobblelaere, S. Patra, Daniel J. Reiley, C. King, T. Yeh, J. Gritters, S. Gutierrez, Y. Loke, M. Harburn, Richard T. Chen, E. Kruglick, Ming C. Wu, A. Husain
{"title":"Digital MEMS switch for planar photonic crossconnects","authors":"L. Fan, S. Gloeckner, P. D. Dobblelaere, S. Patra, Daniel J. Reiley, C. King, T. Yeh, J. Gritters, S. Gutierrez, Y. Loke, M. Harburn, Richard T. Chen, E. Kruglick, Ming C. Wu, A. Husain","doi":"10.1109/OFC.2002.1036227","DOIUrl":null,"url":null,"abstract":"In conclusion we have demonstrated fully nonblocking 16/spl times/16 switches in a single chip solution using MEMS fabricated by a surface micro-machining. We have shown how the critical mechanical elements of the MEMS-cell have been chosen to achieve large mechanical movement, high angular repeatability of the movement, and high reliability of the actuation mechanism, which translated into low loss and high reliability of the packaged component. Test results for these components have been presented.","PeriodicalId":347952,"journal":{"name":"Optical Fiber Communication Conference and Exhibit","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"34","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Optical Fiber Communication Conference and Exhibit","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/OFC.2002.1036227","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 34
Abstract
In conclusion we have demonstrated fully nonblocking 16/spl times/16 switches in a single chip solution using MEMS fabricated by a surface micro-machining. We have shown how the critical mechanical elements of the MEMS-cell have been chosen to achieve large mechanical movement, high angular repeatability of the movement, and high reliability of the actuation mechanism, which translated into low loss and high reliability of the packaged component. Test results for these components have been presented.
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