B. Neff, J. Huneke, M. Nguyen, P. Liu, T. Herrington, S.K. Gupta
{"title":"No-bleed die attach adhesives","authors":"B. Neff, J. Huneke, M. Nguyen, P. Liu, T. Herrington, S.K. Gupta","doi":"10.1109/ISAPM.2005.1432051","DOIUrl":null,"url":null,"abstract":"Resin bleed out (RBO) is a major problem encountered when using die attach adhesives on metal or organic substrates or on top of another die. RBO to the edge of the substrate and/or onto the wire-bonding pad on a die, contaminates these surfaces. This hinders the formation of good wire-bonds between the die-top and the substrate or the wire-bonding fingers. The issue of resin bleed was tackled in three steps: First - understanding the nature of the surface (e.g. surface energy, roughness), and resin properties (e.g. viscosity, molecular weight, surface tension, polarity). Second - modelling the effect of the surface and liquid properties (input), on the adhesive performance (output). Third - design and develop new resins, based on the analysis, to reduce and eliminate resin bleed.","PeriodicalId":181674,"journal":{"name":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","volume":"123 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.2005.1432051","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
Resin bleed out (RBO) is a major problem encountered when using die attach adhesives on metal or organic substrates or on top of another die. RBO to the edge of the substrate and/or onto the wire-bonding pad on a die, contaminates these surfaces. This hinders the formation of good wire-bonds between the die-top and the substrate or the wire-bonding fingers. The issue of resin bleed was tackled in three steps: First - understanding the nature of the surface (e.g. surface energy, roughness), and resin properties (e.g. viscosity, molecular weight, surface tension, polarity). Second - modelling the effect of the surface and liquid properties (input), on the adhesive performance (output). Third - design and develop new resins, based on the analysis, to reduce and eliminate resin bleed.