A Dynamic Model for Bound Abrasive Grinding of Optical Materials: The Effect of Grinding Conditions on the Workpiece Surface Quality

Toshio Takahashi, P. Funkenbusch
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Abstract

A simple dynamic model to describe the grinding behavior in bound abrasive microgrinding of optical materials with CNC (Computerized Numerical Control) machining equipment is discussed and compared with data collected from direct measurement of grinding force. The model involves the relation between grinding force and material removal rate, machine stiffness, and tool condition. Measurements have shown that the tool’s effectiveness and the workpiece surface quality are closely tied through the normal load exerted by the tool on the workpiece during grinding.
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光学材料结合磨料磨削的动态模型:磨削条件对工件表面质量的影响
讨论了用数控加工设备对光学材料进行结合磨料微磨削时的磨削行为的简单动力学模型,并与直接测量磨削力的数据进行了比较。该模型涉及磨削力与材料去除率、机床刚度和刀具状态的关系。测量结果表明,刀具的有效性和工件表面质量通过刀具在磨削过程中施加在工件上的正常载荷密切相关。
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