Advanced modeling of packaged RF MEMS switches and its application on tunable filter implementation

K. Entesari
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引用次数: 2

Abstract

This paper presents advanced modeling of a packaged RF MEMS switch considering the effect of packaging, mounting pad and bond-wires. The importance of the switch advanced model for accurate prediction of tunable filter response is also investigated for three different types of RF MEMS tunable filters; a lumped element 25–75 MHz tunable filter, an inductively-loaded microstrip 1.06–1.23 GHz tunable filer and a surface-integrated-waveguide 1.8–2.3 GHz tunable filter.
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封装RF MEMS开关的先进建模及其在可调谐滤波器实现中的应用
本文提出了一种考虑封装、安装垫和键合线影响的封装RF MEMS开关的高级建模方法。针对三种不同类型的RF MEMS可调谐滤波器,研究了开关先进模型对精确预测可调谐滤波器响应的重要性;一个集总元件25-75 MHz可调谐滤波器,一个电感加载微带1.06-1.23 GHz可调谐滤波器和一个表面集成波导1.8-2.3 GHz可调谐滤波器。
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