D.G. Yang, L. Ernst, K. Jansen, C. van't Hof, G.Q. Zhang, W. V. van Driel, H. Bressers
{"title":"Fully cure-dependent polymer modeling and application to QFN-packages warpage","authors":"D.G. Yang, L. Ernst, K. Jansen, C. van't Hof, G.Q. Zhang, W. V. van Driel, H. Bressers","doi":"10.1109/EPTC.2004.1396582","DOIUrl":null,"url":null,"abstract":"Process-induced warpage is an important issue for package reliability. In order to model the warpage generated during the molding process of QFN packages, a full experimental material characterization of model molding compounds is discussed in This work. Through a method of intermittent cure experiment, the master curve and both a \"temperature shift factor\" and a \"conversion shift factor\" are obtained. A series of molding experiments for QFN matrix strips with the model-molding compounds were performed. In the molding process, different combinations of molding temperature/time and post-cure/time were used. The warpage after molding and after post-cure was measured, respectively. The results show that both the filler percentage and the die thickness have significant effects on the warpage level.","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"119 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2004.1396582","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
Process-induced warpage is an important issue for package reliability. In order to model the warpage generated during the molding process of QFN packages, a full experimental material characterization of model molding compounds is discussed in This work. Through a method of intermittent cure experiment, the master curve and both a "temperature shift factor" and a "conversion shift factor" are obtained. A series of molding experiments for QFN matrix strips with the model-molding compounds were performed. In the molding process, different combinations of molding temperature/time and post-cure/time were used. The warpage after molding and after post-cure was measured, respectively. The results show that both the filler percentage and the die thickness have significant effects on the warpage level.
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