J. Chovan, F. Uherek, M. Tomáška, E. Koza, J. Pavlov, S. Serečunová, D. Seyringer
{"title":"Temperature stability investigation of fiber array to photonics chip butt coupling","authors":"J. Chovan, F. Uherek, M. Tomáška, E. Koza, J. Pavlov, S. Serečunová, D. Seyringer","doi":"10.1063/5.0143468","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":447393,"journal":{"name":"PROCEEDINGS OF THE 11TH INTERNATIONAL ADVANCES IN APPLIED PHYSICS AND MATERIALS SCIENCE CONGRESS & EXHIBITION","volume":"100 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"PROCEEDINGS OF THE 11TH INTERNATIONAL ADVANCES IN APPLIED PHYSICS AND MATERIALS SCIENCE CONGRESS & EXHIBITION","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1063/5.0143468","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
