Surface micromachining of a micro electromechanical inertial transducer based on commercially available Floating Gate Transistor technology

G. Abarca-Jimenez, Gabriel Romero-Paredes Rubio, M. Reyes-Barranca, M. Aleman-Arce, J. Munguia-Cervantes, S. Mendoza-Acevedo
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Abstract

This work presents the results of different surface micromachining processes done on a chip from On Semiconductor 0.5 µm commercially available CMOS technology. The intended objective is to fabricate a MEMS inertial transducer in a monolithic substrate, as the electronics for signal processing are based on a Floating Gate MOS transistor, fully integrated in the electromechanical structure. According to the available layers and design rules from the foundry, an inertial sensor chip was designed and fabricated, except the last post–processing step, i.e., the removal of the sacrificial layer and thus releasing the inertial structure based on a surface micromachining process, allowing the completed device to behave as designed.
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基于市售浮栅晶体管技术的微型机电惯性传感器的表面微加工
这项工作展示了在安森美半导体0.5µm商用CMOS技术芯片上完成的不同表面微加工工艺的结果。预期目标是在单片衬底上制造MEMS惯性换能器,因为用于信号处理的电子器件基于浮栅MOS晶体管,完全集成在机电结构中。根据铸造厂提供的可用层和设计规则,设计并制造了惯性传感器芯片,除了最后的后处理步骤,即去除牺牲层,从而释放基于表面微加工工艺的惯性结构,使完成的器件符合设计要求。
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