A 28nm Embedded Flash Memory with 100MHz Read Operation and 7.42Mb/mm2 at 0.85V featuring for Automotive Application

Hyunjin Shin, Myeonghee Oh, Jaeseung Choi, T. Song, J. Kye
{"title":"A 28nm Embedded Flash Memory with 100MHz Read Operation and 7.42Mb/mm2 at 0.85V featuring for Automotive Application","authors":"Hyunjin Shin, Myeonghee Oh, Jaeseung Choi, T. Song, J. Kye","doi":"10.23919/VLSICircuits52068.2021.9492384","DOIUrl":null,"url":null,"abstract":"A 28nm embedded Flash memory in this paper is designed for the Automotive application in Foundry. Through Temperature Auto-Tracking Sense Amplifier using the Bit line Charge Boost (BCB) and Bit line Leakage current Compensation (BLC) technology, it succeeded in implementing under 10ns read operation (>100MHz) and size improvement (7.42Mb/mm2). Also Word Line and YMUX Gate Boost (WYGB) is applied to secure a sensing margin at a low voltage (0.85V). These techniques enable 10ns reading operation of 288 bits (26.8Gb/s) at a time based on 16Mb memory size by improving sensing margin in temperature range of -40~150’C. It also implemented a competitive minimum IP size and we have secured high yield that enough to mass production as a result of Silicon validation. Based on competitive advantage through technology differentiation, it will be provided to various customers in all eFlash IP Foundry markets including Automotive business.","PeriodicalId":106356,"journal":{"name":"2021 Symposium on VLSI Circuits","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 Symposium on VLSI Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/VLSICircuits52068.2021.9492384","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

A 28nm embedded Flash memory in this paper is designed for the Automotive application in Foundry. Through Temperature Auto-Tracking Sense Amplifier using the Bit line Charge Boost (BCB) and Bit line Leakage current Compensation (BLC) technology, it succeeded in implementing under 10ns read operation (>100MHz) and size improvement (7.42Mb/mm2). Also Word Line and YMUX Gate Boost (WYGB) is applied to secure a sensing margin at a low voltage (0.85V). These techniques enable 10ns reading operation of 288 bits (26.8Gb/s) at a time based on 16Mb memory size by improving sensing margin in temperature range of -40~150’C. It also implemented a competitive minimum IP size and we have secured high yield that enough to mass production as a result of Silicon validation. Based on competitive advantage through technology differentiation, it will be provided to various customers in all eFlash IP Foundry markets including Automotive business.
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一款28nm嵌入式闪存,具有100MHz读取操作和7.42Mb/mm2, 0.85V,适用于汽车应用
本文设计了一种28nm嵌入式快闪存储器,用于汽车代工应用。通过采用位线电荷增强(BCB)和位线漏电流补偿(BLC)技术的温度自动跟踪感测放大器,成功地实现了10ns读取操作(>100MHz)和尺寸改进(7.42Mb/mm2)。此外,字线和YMUX栅极升压(WYGB)用于确保低电压(0.85V)下的感应裕度。这些技术通过提高在-40~150℃温度范围内的感知裕度,在16Mb内存大小的基础上实现了10ns读取288位(26.8Gb/s)的操作。它还实现了具有竞争力的最小IP尺寸,并且由于硅验证,我们已经获得了足以大规模生产的高产量。基于技术差异化的竞争优势,它将提供给包括汽车业务在内的所有eFlash IP代工市场的各种客户。
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