Austin Chen, Y. Baeyens, Young-Kai Chen, Jenshan Lin
{"title":"A 68-82 GHz integrated wideband linear receiver using 0.18 µm SiGe BiCMOS","authors":"Austin Chen, Y. Baeyens, Young-Kai Chen, Jenshan Lin","doi":"10.1109/RFIC.2010.5477281","DOIUrl":null,"url":null,"abstract":"This paper presents a highly integrated wideband linear receiver with on-chip active frequency doubler implemented in a low-cost 200/180 GHz fT/fmax 0.18 µm SiGe BiCMOS technology. Individual receiver circuit blocks including low-noise amplifier, passive balun, mixer, and frequency doubler have been independently characterized and optimized for wideband, NF, and linearity performance. The receiver highlights a 3 dB RF bandwidth of larger than 14 GHz from 68 GHz to at least 82 GHz. The measured peak power conversion gain is 28.1 dB with an input 1 dB compression point of −23.6 dBm, and NF of 8 dB at 77 GHz. Noise figures of 8–10 dB are achieved over the 3 dB bandwidth. The overall chip size is 1350 × 990 µm2 and the total power consumption is 413 mW. To the best of authors' knowledge, this receiver reports the highest 3 dB RF bandwidth with excellent linearity performance among all the prior arts in SiGe HBT/BiCMOS technologies to date.","PeriodicalId":269027,"journal":{"name":"2010 IEEE Radio Frequency Integrated Circuits Symposium","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE Radio Frequency Integrated Circuits Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RFIC.2010.5477281","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13
Abstract
This paper presents a highly integrated wideband linear receiver with on-chip active frequency doubler implemented in a low-cost 200/180 GHz fT/fmax 0.18 µm SiGe BiCMOS technology. Individual receiver circuit blocks including low-noise amplifier, passive balun, mixer, and frequency doubler have been independently characterized and optimized for wideband, NF, and linearity performance. The receiver highlights a 3 dB RF bandwidth of larger than 14 GHz from 68 GHz to at least 82 GHz. The measured peak power conversion gain is 28.1 dB with an input 1 dB compression point of −23.6 dBm, and NF of 8 dB at 77 GHz. Noise figures of 8–10 dB are achieved over the 3 dB bandwidth. The overall chip size is 1350 × 990 µm2 and the total power consumption is 413 mW. To the best of authors' knowledge, this receiver reports the highest 3 dB RF bandwidth with excellent linearity performance among all the prior arts in SiGe HBT/BiCMOS technologies to date.