{"title":"The design and implementation of the TRIPS prototype chip","authors":"Robert G. McDonald, D. Burger, S. Keckler","doi":"10.1109/HOTCHIPS.2005.7476592","DOIUrl":null,"url":null,"abstract":"This article consists of a collection of slides from the authors' conference presentation. They conclude that: distributed microarchitecture acknowledges and tolerates wire delay and scalable protocols tailored for distributed components. Tiled microarchitecture simplifies scalability and improves design productivity. The next step for instruction-level parallelism is EDGE ISA enables increased ILP while also exploiting coarser types of parallelism.","PeriodicalId":357616,"journal":{"name":"2005 IEEE Hot Chips XVII Symposium (HCS)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 IEEE Hot Chips XVII Symposium (HCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOTCHIPS.2005.7476592","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
This article consists of a collection of slides from the authors' conference presentation. They conclude that: distributed microarchitecture acknowledges and tolerates wire delay and scalable protocols tailored for distributed components. Tiled microarchitecture simplifies scalability and improves design productivity. The next step for instruction-level parallelism is EDGE ISA enables increased ILP while also exploiting coarser types of parallelism.