Integrated Thermo-Electro-Mechanical Modeling of 3D e-Cubes Structures

G. Janczyk, T. Bieniek, P. Janus, A. Kociubiński, P. Grabiec, J. Szynka, M.S. Reitz, P. Schneider, E. Kaulfersch, J. Weber
{"title":"Integrated Thermo-Electro-Mechanical Modeling of 3D e-Cubes Structures","authors":"G. Janczyk, T. Bieniek, P. Janus, A. Kociubiński, P. Grabiec, J. Szynka, M.S. Reitz, P. Schneider, E. Kaulfersch, J. Weber","doi":"10.1109/MIXDES.2007.4286171","DOIUrl":null,"url":null,"abstract":"The complex silicon systems formed by the several specialized devices like SOC, RF devices, power devices, MEMS wafers are fabricated in dedicated technologies. If the designer attempts to integrate them into the one big multifunctional system, he meets the new, yet unexplored fields for the multidisciplinary, mutually dependent thermal, electrical, EM and mechanical parameters modeling. This article attempts to clarify, and presents how to simplify this problem.","PeriodicalId":310187,"journal":{"name":"2007 14th International Conference on Mixed Design of Integrated Circuits and Systems","volume":"12 1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 14th International Conference on Mixed Design of Integrated Circuits and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MIXDES.2007.4286171","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

The complex silicon systems formed by the several specialized devices like SOC, RF devices, power devices, MEMS wafers are fabricated in dedicated technologies. If the designer attempts to integrate them into the one big multifunctional system, he meets the new, yet unexplored fields for the multidisciplinary, mutually dependent thermal, electrical, EM and mechanical parameters modeling. This article attempts to clarify, and presents how to simplify this problem.
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三维电子立方体结构的热-电-机械集成建模
由SOC、RF器件、功率器件、MEMS晶圆等多种专用器件组成的复杂硅系统采用专用技术制造。如果设计师试图将它们整合到一个大的多功能系统中,他就会遇到新的、尚未开发的多学科、相互依赖的热、电、电磁和机械参数建模领域。本文试图澄清并介绍如何简化这个问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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