Influence of Ball Size and Geometry on the Reliability and RF Performance of mmWave System-in-Package: A Simulation Approach

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2021-04-19 DOI:10.1109/EuroSimE52062.2021.9410849

S. Dilek, I. Ndip, Marco Rossi, C. Tschoban, S. Kuttler, O. Wittler, K. Lang, Christian Goetze, Daniel Berger, M. Wieland, M. Schneider-Ramelow

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引用次数: 1

Abstract

Solder ball reliability is a long-discussed topic in microelectronic packaging. With new package types needed for mmWave applications a trade-off between reliability and RF performance may arise, when the solder ball geometry has to be selected for specific package assemblies. In this work, the lifetime for different solder ball geometries is investigated within a numerical simulation workflow, by means of a sensitivity analysis in which the ball diameter, pad sizes and stand-off distance are varied. Next to lifetime estimations, 3D full-wave simulations have been applied to analyze the RF performance of the structures under investigation at 77-79 GHz (E-band) center frequencies relevant for automotive radar applications. Finally, the trade-off between RF performance and reliability is illustrated and quantified.

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球尺寸和几何形状对毫米波系统级封装可靠性和射频性能的影响:一种仿真方法

焊锡球的可靠性是微电子封装领域一个长期讨论的问题。随着毫米波应用需要新的封装类型，当必须为特定封装组件选择焊球几何形状时，可能会出现可靠性和射频性能之间的权衡。在这项工作中，通过灵敏度分析，在数值模拟工作流程中研究了不同形状的焊接球的寿命，其中球直径、焊盘尺寸和距离是不同的。除了寿命估计之外，3D全波模拟还用于分析与汽车雷达应用相关的77-79 GHz (e波段)中心频率下所研究结构的射频性能。最后，对射频性能和可靠性之间的权衡进行了说明和量化。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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