PRESSURE DROP CHARACTERISTICS OF CIRCUIT BOARD WITH ARRAYS OF LSI PACKAGES

H. Matsushima, T. Yanagida, W. Nakayama
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引用次数: 1

Abstract

Experimental investigation was performed to study the pressure drop characteristics of parallel-plate channels where model packages of various sizes are mounted. The ratio of channel height to package height and placement pitch to package height are 1.3∼2.7 and 1.8∼5.6 for packages without fins, and 1.2∼2.0 and 2.1∼3.4 for finned packages, respectively. A new flow model is proposed which incorporates the three-dimensional nature of wakes behind the packages. The predicted values of pressure drop based on this model correlate with the experimental results within ±20∼30%.
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lsi封装阵列电路板的压降特性
对安装不同尺寸模型包的平行板通道的压降特性进行了实验研究。无翅片封装的通道高度与封装高度之比为1.3 ~ 2.7和1.8 ~ 5.6,有翅片封装的通道高度与封装高度之比为1.2 ~ 2.0和2.1 ~ 3.4。提出了一种新的流动模型,其中包含了包后尾迹的三维特性。基于该模型的压降预测值与实验结果的相关性在±20 ~ 30%之间。
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