{"title":"Design and Implementation of Forced Air-cooled, 140kHz, 20kW SiC MOSFET based Vienna PFC","authors":"Siyuan Chen, Wensong Yu, Dennis Meyer","doi":"10.1109/APEC.2019.8721979","DOIUrl":null,"url":null,"abstract":"In this paper, a forced air-cooled, 140kHz, 20kW SiC MOSFET based Vienna power factor rectifier (PFC) is presented. Compared with Si device, the wide bandgap (WBG) semiconductor device allows to increase the switching frequency and reduce the volume of passive components. The modulation scheme of T-type converter is implemented in Vienna PFC to reduce the switching loss and improve efficiency to 98.5%. Power semiconductor device losses are calculated for thermal design. The new phase-change thermal material and AlN thermal interface are used to decrease the thermal impedance. For EMI filter design, a feedback damping resistor is added to common-mode loop to improve the phase margin and stability. Experimental results verify the design concepts and high efficiency.","PeriodicalId":142409,"journal":{"name":"2019 IEEE Applied Power Electronics Conference and Exposition (APEC)","volume":"89 6","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"21","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE Applied Power Electronics Conference and Exposition (APEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC.2019.8721979","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 21
Abstract
In this paper, a forced air-cooled, 140kHz, 20kW SiC MOSFET based Vienna power factor rectifier (PFC) is presented. Compared with Si device, the wide bandgap (WBG) semiconductor device allows to increase the switching frequency and reduce the volume of passive components. The modulation scheme of T-type converter is implemented in Vienna PFC to reduce the switching loss and improve efficiency to 98.5%. Power semiconductor device losses are calculated for thermal design. The new phase-change thermal material and AlN thermal interface are used to decrease the thermal impedance. For EMI filter design, a feedback damping resistor is added to common-mode loop to improve the phase margin and stability. Experimental results verify the design concepts and high efficiency.
本文提出了一种强制风冷、140kHz、20kW SiC MOSFET的维也纳功率因数整流器(PFC)。与硅器件相比，宽禁带半导体器件可以提高开关频率，减少无源器件的体积。在维也纳PFC中实现了t型变换器的调制方案，降低了开关损耗，效率提高到98.5%。功率半导体器件的损耗计算用于热设计。采用新型相变热材料和AlN热界面来降低热阻抗。在EMI滤波器设计中，在共模环路中加入反馈阻尼电阻，提高了相位裕度和稳定性。实验结果验证了设计理念和高效率。
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