{"title":"Dual-Angle Imaging System (DAISy) for Determining the Thickness of a Dielectric Thin Film","authors":"Yang Deng, Diana Magana, Zheng Tan, J. Kruschwitz","doi":"10.1364/OIC.2019.THC.4","DOIUrl":null,"url":null,"abstract":"A team of undergraduate engineers in Optics were tasked to build a Dual-Angle Imaging System (DAISy) to measure the physical thickness of a dielectric film on silicon. This paper details their working prototype design.","PeriodicalId":119323,"journal":{"name":"Optical Interference Coatings Conference (OIC) 2019","volume":"456 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Optical Interference Coatings Conference (OIC) 2019","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1364/OIC.2019.THC.4","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A team of undergraduate engineers in Optics were tasked to build a Dual-Angle Imaging System (DAISy) to measure the physical thickness of a dielectric film on silicon. This paper details their working prototype design.