L. Shan, M. Meghelli, Joong-Ho Kim, J. Trewhella, M. Taubenblatt, M. Oprysko
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引用次数: 8
Abstract
A 40 Gb/s package design is introduced in this work. The package includes high-speed coaxial connectors, transmission lines on ceramic substrate, and ribbon bonds. To keep the model structure under the existing computing capability, the simulation was segmented into three sections - coaxial connector to transmission line, transmission line alone, and transmission line to ribbon bond, and then the results were assembled to predict the performance of the package. Both small signal measurements and operational tests were performed to verify the design and modeling concepts. The package was operated up to 50 Gb/s with low degradation to input digital waveforms.
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