{"title":"Palladium-catalyzed sintering of molybdenum paste applied to multilayer substrate fabrication","authors":"A. Kumar","doi":"10.1109/ECTC.1993.346791","DOIUrl":null,"url":null,"abstract":"This paper describes a novel method for densifying the surfaces of external, thick film molybdenum circuit features of multilayer ceramic substrates using palladium as a sintering catalyst. Such dense sintering of the surface effectively prevents the formation of undesirable pools of glass on the surfaces of the external features, making it possible to perform contact-probe electrical testing prior to plating and to nickel plate the molybdenum features without the customary cleaning steps needed to clear the pools of glass.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1993.346791","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper describes a novel method for densifying the surfaces of external, thick film molybdenum circuit features of multilayer ceramic substrates using palladium as a sintering catalyst. Such dense sintering of the surface effectively prevents the formation of undesirable pools of glass on the surfaces of the external features, making it possible to perform contact-probe electrical testing prior to plating and to nickel plate the molybdenum features without the customary cleaning steps needed to clear the pools of glass.<>
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
